 |
The Dawn ATR-3500 Series Rugged Enclosure offers a unique and innovative cooling concept, Thermal Exchanged Flow (TEF), in conjunction with standard MicroTCA board platforms, resulting in the most cost-effective, rugged solution available. The TEF uses a two-stage cooling system consisting of a completely-sealed inner housing and forced air outer-housing. The inner-housing incorporates the power module, MCH module, and up to four AMC modules.
Front View
|
- MicroTCA Rugged Conduction-Cooled Solution
- 100% Sealed Electronics Compartment
- Six-slot MicroTCA Backplane
- Precision-Machined Card Guides result in Maximum Tolerances
- Complete with Dawn's RuSH System Health Monitor
- 6061-T Aluminum Housing
- MIL-STD-901D, MIL-STD-801F, MIL-STD-461E
- CompactPCI and VPX Backplane Options
|
|
|
 |
